Technical Program

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TA.L1: HEVC Intra Coding

Session Type: Lecture
Time: Tuesday, September 27, 10:30 - 12:30
Location: Room 101 A
Session Chair: Frederic Dufaux, Télécom ParisTech
 
Presented 10:30 - 10:50
 TA.L1.1: COMBINING DIRECTIONAL INTRA PREDICTION AND INTRA BLOCK COPY WITH BLOCK PARTITION FOR HEVC
         Yue Li; University of science and Technology of China
         Li Li; University of science and Technology of China
         Dong Liu; University of science and Technology of China
         Houqiang Li; University of science and Technology of China
         Feng Wu; University of science and Technology of China
 
Presented 10:50 - 11:10
 TA.L1.2: TWO-STAGE EXCLUSION OF ANGULAR INTRA PREDICTION MODES FOR FAST MODE DECISION IN HEVC
         Andreas Heindel; Friedrich-Alexander-Universität Erlangen-Nürnberg
         Christoph Pylinski; Friedrich-Alexander-Universität Erlangen-Nürnberg
         André Kaup; Friedrich-Alexander-Universität Erlangen-Nürnberg
 
Presented 11:10 - 11:30
 TA.L1.3: POSITION DEPENDENT PREDICTION COMBINATION FOR INTRA-FRAME VIDEO CODING
         Amir Said; Qualcomm Technologies, Inc.
         Xin Zhao; Qualcomm Technologies, Inc.
         Marta Karczewicz; Qualcomm Technologies, Inc.
         Jianle Chen; Qualcomm Technologies, Inc.
         Feng Zou; Qualcomm Technologies, Inc.
 
Presented 11:30 - 11:50
 TA.L1.4: MODE DEPENDENT INTRA SMOOTHING FILTER FOR HEVC
         Yang Wang; Harbin Institute of Technology
         Xiaopeng Fan; Harbin Institute of Technology
         Debin Zhao; Harbin Institute of Technology
         Wen Gao; Peking University
 
Presented 11:50 - 12:10
 TA.L1.5: JOINT OPTIMIZATION OF RATE, DISTORTION, AND DECODING ENERGY FOR HEVC INTRAFRAME CODING
         Christian Herglotz; Friedrich-Alexander-Universität Erlangen-Nürnberg
         André Kaup; Friedrich-Alexander-Universität Erlangen-Nürnberg
 
Presented 12:10 - 12:30
 TA.L1.6: AVX2–OPTIMIZED KVAZAAR HEVC INTRA ENCODER
         Ari Lemmetti; Tampere University of Technology
         Ari Koivula; Tampere University of Technology
         Marko Viitanen; Tampere University of Technology
         Jarno Vanne; Tampere University of Technology
         Timo Hämäläinen; Tampere University of Technology